复合材料科学与工程 ›› 2021, Vol. 0 ›› Issue (6): 39-44.DOI: 10.19936/j.cnki.2096-8000.20210628.006

• 基础研究 • 上一篇    下一篇

基于P单元复合材料胶接修理胶层应力分析

王专利1,2, 张发2*, 王亮1, 陈宁1   

  1. 1.中国商飞上海飞机制造有限公司 复合材料中心,上海 200123;
    2.中国商飞北京民用飞机技术研究中心 民用飞机结构与复合材料北京市重点实验室,北京 102211
  • 收稿日期:2021-02-18 出版日期:2021-06-28 发布日期:2021-08-03
  • 通讯作者: 张发(1986-),男,博士,高级工程师,主要从事复合材料力学结构响应方面的研究,fafa6733204@163.com。
  • 作者简介:王专利(1978-),男,硕士,高级工程师,主要从事复合材料结构维修维护方面的研究。
  • 基金资助:
    工信部民机科研专项(MJ-2017-F-20)

STRESS ANALYSIS OF ADHESIVE LAYER OF COMPOSITE REPAIR BASEDON THE P-VERSION ELEMENT METHOD

WANG Zhuan-li1,2, ZHANG Fa2*, WANG Liang1, CHEN Ning1   

  1. 1. Composites Center, COMAC Shanghai Aircraft Manufacturing Co., Ltd., Shanghai 200123, China;
    2. Beijing Key Laboratory of Civil Aircraft Structures and Composite Material,COMAC Beijing Aircraft Technology Research Institute, Beijing 102211, China
  • Received:2021-02-18 Online:2021-06-28 Published:2021-08-03

摘要: 胶接修理是复合材料常见的一种修理方法,准确分析修理胶层应力一直是一个难题。传统有限元方法基于h单元(不高于2阶单元)用于复合材料层压板胶接修理面临长宽比值过高的问题,为了提高计算精度,需要花费巨大精力细化网格。先进有限元方法采用P单元(可高达8阶单元)可实现单元长宽比200∶1以上,非常适合复合材料层压板胶接修理分析。本文对比层压板阶梯式挖补胶接修理工程简化分析方法,采用StressCheck软件P单元进行胶层剪应力和剥离应力分析。对比结果表明,基于P单元的有限元法因考虑了各台阶载荷偏心引起的附加弯矩,胶层应力结果更加真实,可以应用于工程分析。

关键词: 复合材料, 胶接, 挖补修理, 剪切应力, 剥离应力

Abstract: Bonding repair is a common kind of composite repairing method. Accurate analysis of stress of repair adhesive layer is always a difficult problem for engineers. The traditional finite element method (FEM) based on H element (less than 2 order) for composite laminate bonding repair is faced with the problem of high ratio of length to width. In order to improve the calculation accuracy, great efforts have to be spent on refining mesh. Advanced FEM using P element (up to 8 order) can achieve the element length-width ratio of more than 200∶1, which is very suitable for composite laminate bonding repair analysis. In this paper, a simplified analysis method for the laminate step-step excavation and bonding repair is used. Furthermore,based on the StressCheck software P element,the shear stress and peeling stress of the adhesive layer are analyzed. The comparison results show that the stress results of the adhesive layer based on P element are more realistic, due to the fact that it considers the additional bending moment caused by the eccentricity of each step load. This indicates that this new method can be applied to engineering analysis.

Key words: composite; bonding; step patch repair; shear stress; peel stress

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