含硼酸酯键的可降解环氧树脂基复合材料的制备与性能研究

doi:10.19936/j.cnki.2096-8000.20220128.014

摘要/Abstract

摘要： 本文采用苯硼酸(PBA)代替传统的环氧树脂固化剂,制备了一种在温和条件下可绿色降解的含硼酸酯键的环氧树脂(PBAE)。利用FTIR、DSC、TGA探究了PBAE树脂固化过程中的结构变化和耐热性能。研究结果表明PBAE结构中形成了硼酸酯键,固化物具有优异的耐热性能,玻璃化转变温度(T_g)为147 ℃,N₂氛围下质量损失5%的温度(T_d5)为267 ℃,800 ℃的质量保留率高于25%。玻璃纤维增强PBAE复合材料的弯曲强度和层间剪切强度分别为499 MPa、70 MPa;可在常温下,乙醇/水混合溶液(体积比=2∶1)中实现绿色降解。

关键词: 苯硼酸, 环氧树脂, 可回收, 绿色降解, 耐热性能, 复合材料

Abstract: The three-dimensional network structure of traditional epoxy resin not only endows it with good properties, but also brings challenges to its reprocessing and recycling. In recent years, the introduction of dynamic covalent bond into thermosetting resin to achieve degradation has been emerging, but it is still an urgent requirement to achieve degradation in a mild and green method. In this paper, phenylboronic acid (PBA) was used to cure bisphenol-A epoxy resin (DGEBA, E44) to form dynamic borate ester bond. The superior heat resistance of cured resin (PBAE) was investigated by Differential Scanning Calorimetry (DSC) and Thermogravimetric analysis (TGA). Glass transition temperature (T_g) and 5% weight loss temperature (T_d5) were 147 ℃ and 267 ℃ respectively, while the mass retention rate at 800 ℃ is higher than 25%. Based on this matrix, recyclable glass fiber-reinforced PBAE composite was prepared, which could achieve green and mild degradation in ethanol aqueous solution (volume ratio=2∶1) at room temperature. PBAE composite exhibited comparable mechanical properties, with bending strength of 499 MPa and interlaminar shear strength of 70 MPa. In addition, PBAE composites could facilely achieve self-healing under heating and pressure conditions.

Key words: phenylboronic acid, epoxy resin, recyclable, green degradation, heat resistance, composites

中图分类号:

TB332

张文华, 方超宇, 李鑫, 尤立文, 亓奕卿, 周权. 含硼酸酯键的可降解环氧树脂基复合材料的制备与性能研究[J]. 复合材料科学与工程, 2022, 0(1): 91-97.

ZHANG Wen-hua, FANG Chao-yu, LI Xin, YOU Li-wen, QI Yi-qing, ZHOU Quan. Study on preparation and properties of degradable epoxy composites containing borate ester bond[J]. COMPOSITES SCIENCE AND ENGINEERING, 2022, 0(1): 91-97.

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