复合材料科学与工程 ›› 2022, Vol. 0 ›› Issue (4): 87-91.DOI: 10.19936/j.cnki.2096-8000.20220428.014

• 应用研究 • 上一篇    下一篇

PMI泡沫在微带天线阵面上的应用研究

刘秀利   

  1. 中国电子科技集团公司第十研究所,成都610036
  • 收稿日期:2001-07-08 出版日期:2022-04-28 发布日期:2022-06-02
  • 作者简介:刘秀利(1978-),女,学士,高级工程师,主要从事电子设备整机工艺方面的研究。

Application of PMI foam on microstrip antenna array

LIU Xiu-li   

  1. The 10th Institute of China Electronic Technology Corporation, Chengdu 610036, China
  • Received:2001-07-08 Online:2022-04-28 Published:2022-06-02

摘要: 为了实现某毫米波微带天线的低损耗透波这一设计需求,开展PMI泡沫夹层结构的微带天线阵面制造研究。选用硬性封孔结构PMI泡沫作为天线阵面上下两层微带之间的介质夹层材料,采用热固性导电半固化片作为胶接材料,并通过PCB真空热压工艺实现上述PMI泡沫夹层结构的胶接成型。详细论述了PMI泡沫夹层微带天线阵面的工艺流程、PMI泡沫选材方案、PMI泡沫加工注意事项及夹层结构胶接等工艺技术。根据提出的工艺方案试制了样件,并对样件进行电性能指标测试和拉力试验,试验结果表明:PMI夹层结构指标性能优异、胶接强度良好,满足微带天线阵面设计要求。

关键词: PMI泡沫, 微带天线, 天线阵面, 胶接, 复合材料

Abstract: In order to meet the requirement of a millimeter wave microstrip antenna with low-loss transmission, the fabrication of microstrip arry with PMI foam sandwich structure was investigated. PMI foam with rigid sealing structure is selected as the interlayer between the two layers of microstrip on the antenna array, thermoset conductive semi-solidified sheet was used as the cementing materia, and the PMI foam sandwich structure was cemented by vacuum hot-pressing process of PCB. The technology of PMI foam material selection, PMI foam fabrication and bonding of sandwich structure are discussed. According to the proposed technological approach, the sample is trial-produced, and the index test and tensile test are carried out. The test results show that the PMI sandwich structure has excellent performance and good bonding strength,which can satisfy the design of microstrip antenna array.

Key words: PMI foam, microstrip antenna, antenna array, bonding, composites

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