最概然Malek法分析TDE85/MeNA环氧树脂体系固化机理

摘要/Abstract

摘要：

采用非等温DSC法对三官能团环氧树脂TDE85与甲基纳迪克酸酐（MeNA）固化体系进行了放热特性分析，升

温速率分别为5k/min、10k/min、15k/min、20k/min、25k/min及35k/min。在此基础上重点提出最概然Malek

FlynnWallOzawa分析法，对其固化反应机理进行固化动力学参数分析，建立了能够正确描述固化反应过程的机

理模型。该方法求得固化体系反应表观活化能为E=67.05kJ/mol，表观指前因子为A=5.05×109s1，反应机理函数

为f(a)=22.24(1-a)1.76。最后通过实验数据对最概然Malek FlynnWallOzawa分析法进行验证，证明该方法

能够精确的描述固化反应过程和机理特征。

关键词: TDE-85环氧树脂, 非等温DSC, 最概然Malek法, 固化动力学模型

Abstract:

The kinetics of the cure reaction for a system of TDE85/MeNA epoxy resin was monitored

by the differential scanning calorimetry(DSC) and investigated by the constant heating methods.

According to the DSC graphs， the Tβ graph extrapolation was used to get the characteristic

curing process temperatures， and to confirm the technical parameters of the molding process of the

resin system. The kinetic parameters of the curing reaction of TDE85/MeNA epoxy resin such as the

overall activation energy Ea， the frequency factor A and the reaction equation were obtained， the

results were that : E=67.05kJ/mol， A=5.05×109s1.The curing reaction was calculated accurately by

using the correct kinetic model，and was set up by using Malek and FlynnWallOzawa equation. The

result of comparing the heating flow graph from the kinetic model and the examination was in harmony

， it illuminated that the kinetic model could be used to depict the curing reaction of the TDE

85/MeNA epoxy system.

Key words: epoxy resin, differential scanning calorimetry(DSC), Malek equation, kinetic model

中图分类号:

TQ323.5

郭建君, 孙晋良, 任慕苏, 白瑞成. 最概然Malek法分析TDE85/MeNA环氧树脂体系固化机理[J]. 玻璃钢/复合材料, 2009, 205(6): 12-15.

Guo, J. J., Sun, J. L., Ren, M. S., Bai, R. C.. THE USING OF MALEK AND FLYNNWALLOZAWA EQUATION IN CURING REACTION
OF TDE85/MENA EPOXY RESIN SYSTEM[J]. Fiber Reinforced Plastics/Composites, 2009, 205(6): 12-15.

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