复合材料科学与工程 ›› 2013, Vol. 0 ›› Issue (2): 34-38.

• 基础研究 • 上一篇    下一篇

含硅芳炔树脂的热氧化降解动力学研究

池铁, 齐会民*, 黄发荣, 杜磊   

  1. 华东理工大学材料科学与工程学院,特种功能高分子材料及相关技术教育部重点实验室,上海200237
  • 收稿日期:2012-02-07 发布日期:2022-03-17
  • 通讯作者: 齐会民,qihm@ecust.edu.cn。
  • 作者简介:池铁(1986-),男,硕士研究生,主要从事耐高温树脂及其复合材料研究。本文作者还有张玲玲和郭康康。
  • 基金资助:
    国家自然科学基金(90816021)

THERMAL OXIADATIVE DEGRADATION KINETICS OF SILICON-ARYLACETYLENE-CONTAINING RESIN

CHI Tie, QI Hui-min*, HUANG Fa-rong, DU Lei   

  1. Key Laboratory for Specially Functional Polymer Materials and Related Technologies of Ministry of Education,School of Materials Science and Engineering,East China University of Science and Technology,Shanghai 200237,China
  • Received:2012-02-07 Published:2022-03-17

摘要: 含硅芳炔树脂是一种新型的耐高温热固性树脂,具有优异的耐热性能、优良的介电性能、高温力学性能和优异的工艺性能,广泛应用于航空航天、电子信息领域。本文用热失重方法(TGA) 研究了含硅芳炔树脂的热氧化降解动力学。结果显示含硅芳炔树脂的热氧化降解过程分为三个阶段,热氧化增重阶段、热氧化降解阶段Ⅰ、热氧化降解阶段Ⅱ。采用Ozawa 和Kissinger 方法分析了含硅芳炔树脂热氧化降解的三个阶段的活化能、反应级数、频率因子等动力学参数。

关键词: 含硅芳炔树脂, 热氧化, 降解动力学

Abstract: Silicon-arylacetylene-containing resin (PSA-R) offers excellent high-temperature resistance,low dielectric constant,high-temperature mechanical property and easy processability. The kinetics of the thermal oxidative degradation of silicon-arylacetylene-containing resin was investigated by thermogravimetric analysis (TGA) under air. The thermal oxidative degradation of PSA-R had three different processes: thermal oxidation of unsaturated chain,thermal oxidative degradation of end-,side-chain scission and main-chain. The corresponding kinetic parameters include activation energy,pre-exponential factor and empirical order of the thermal oxidative degradation stages were evaluated by using Ozawa and Kissinger metnods,respectively.

Key words: silicon-containing arylacetylene resin, thermal oxidative, kinetics

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