复合材料科学与工程 ›› 2013, Vol. 0 ›› Issue (5): 7-13.

• 基础研究 • 上一篇    下一篇

环氧树脂聚酰胺体系微波固化特性研究

耿杰, 李勇*, 陈云雷, 肖军   

  1. 南京航空航天大学材料科学与技术学院,南京 10016
  • 收稿日期:2012-08-15 出版日期:2013-08-28 发布日期:2022-03-15
  • 通讯作者: 李勇(1970-),男,博士,教授,主要从事树脂基复合材料的研究。
  • 作者简介:耿杰(1988-),男,硕士研究生,主要研究方向为复合材料自动化制造工艺。本文作者还有周克印。
  • 基金资助:
    国家科技支撑计划(2012BAA01B02)

STUDY ON CURING BEHAVIOR OF EPOXY POLYAMIDE MICROWAVE CURING SYSTEM

GENG Jie, LI Yong*, CHEN Yun-lei, XIAO Jun   

  1. College of Material Science and Technology,Nanjing University of Aeronautics & Astronautics, Nanjing 210016,China
  • Received:2012-08-15 Online:2013-08-28 Published:2022-03-15

摘要: 微波固化相对于传统热固化有着固化效率高、无污染、设备投资小等优势。针对双酚A 型环氧树脂聚酰胺固化体系,采用DSC 测固化度表征微波固化行为,优化体系成份配比,设计正交试验表考察微波固化工艺参数对固化行为的影响,并对两种不同固化方式产物的玻璃化转变温度进行比较。结果表明: 微波固化体系最优配比为环氧E51∶ 650聚酰胺∶ 660A活性稀释剂= 100∶ 80∶ 12;影响该体系固化效率的微波固化工艺参数主次顺序依次为加热时间、输出功率、加热周期、间歇时间; 该体系微波固化产物的玻璃化转变温度及弯曲性能较热固化产物有一定程度的降低,分析得出微波场的不均匀性是这一现象产生的重要影响因素。

关键词: 微波固化, 环氧树脂, 工艺参数, 玻璃化转变温度

Abstract: Compared with traditional heat curing,microwave curing has the advantages of high efficiency,nonpollution, low cost of equipment and so on. As known,curing degree is determined by DSC,which is used to describe the progress of the microwave curing behavior of bisphenol-A type epoxy resin E51 /650 polyamide reaction system. According to the curing efficiency,this paper optimizes formula ratio of the system component. Then,an orthogonal experiment table was designed to investigate microwave curing process parameters and contrast glass-transition temperatures of cured roducts in two different curing methods. The results showed that the optimal proportion of the system for microwave curing is 100 to 80 to 12 ratio of epoxy E51 to 650 polyamide to 660 A active diluents. And the order of microwave curing parameters that affect the degree of cure is the heating time,the output power, heating cycle and intermittent time. In addition,the glass-transition temperature and bending property of microwave curing product is decreased at a certain extent that because of the uniformity of microwave field and the output way of microwave power.

Key words: microwave curing, epoxy resin, technological parameter, glass-transition temperature

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