复合材料科学与工程 ›› 2014, Vol. 0 ›› Issue (5): 51-55.

• 应用研究 • 上一篇    下一篇

碳纤维/环氧复合材料孔隙缺陷的工艺影响因素研究

陈超1, 张娅婷2, 顾轶卓1*, 张华婷2   

  1. 1.北京航空航天大学材料科学与工程学院,空天材料与服役教育部重点实验室,北京100191;
    2.航天材料及工艺研究所,北京100076
  • 收稿日期:2013-01-03 出版日期:2014-05-28 发布日期:2021-09-14
  • 通讯作者: 顾轶卓(1979-),男,副教授,硕士生导师,主要从事复合材料方面的研究,benniegu@buaa.edu.cn。
  • 作者简介:陈超(1989-),男,博士研究生,主要从事复合材料方面的研究。本文作者还有仵剑2,李艳霞1,李敏1和张佐光1

STUDY OF THE EFFECTS OF PROCESSING CONDITIONS ON VOID DEFECT IN CARBON FIBER/EPOXY COMPOSITES

CHEN Chao1, ZHANG Ya-ting2, GU Yi-zhuo1*, ZHANG Hua-ting2   

  1. 1. Key Laboratory of Aerospace Advanced Materials and Performance (Ministry of Education),School of Materials Science and Engineering, Beihang University, Beijing 100191, China;
    2. Aerospace Research Institute of Materials &Processing Technology, Beijing 100076, China
  • Received:2013-01-03 Online:2014-05-28 Published:2021-09-14

摘要: 针对复合材料热压工艺建立了一套可以研究孔隙形成规律的工艺实验模拟装置,采用该装置考查了成型压力、加压点、吸胶方式、试样厚度等因素对孔隙的影响。结果表明,所建立的研究方法可以获取孔隙与工艺因素的关联规律;对于MT300/603碳纤维/环氧预浸料,成型压力的增大与加压点温度的降低都可以降低孔隙率与孔隙尺寸,但压力对于孔隙率的消除效果更明显;孔隙消除机理中的树脂流动带出气泡起主要作用,而压力的压溃和排气作用起次要作用;铺层厚度对孔隙形成有明显影响。研究结果对于热压工艺复合材料孔隙缺陷的控制提供了重要的研究手段和实验依据。

关键词: 复合材料, 热压工艺, 预浸料, 孔隙

Abstract: A experimental simulation system for composites in hot pressing process was established for studying void formation evolution. By means of this system, the effects of molding pressure, pressure applying moment, bleeding mode and sample thickness on void were investigated. The results indicate that the simulation system can be used to obtain the relationship between void and processing factors. For MT300/603 carbon fiber/epoxy prepreg, increasing molding pressure and decreasing pressure applying temperature can reduce porosity and void size, and the molding pressure is more obvious for eliminating void. Moreover, resin flow plays an important role in void elimination mechanism rather than pressure squashing and venting effects. Thickness of prepreg stack has significant effect on void formation. These results provide important studying method and experimental evidences for void defect control in composites for hot pressing process.

Key words: composites, hot pressing process, prepreg, void

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