玻璃钢/复合材料 ›› 2017, Vol. 0 ›› Issue (2): 15-20.

• 基础研究 • 上一篇    下一篇

挖补角度对复合材料修补片固化过程温度和热应力的影响

唐庆如, 田秋实, 庞 杰, 陈淑仙*   

  1. 中国民航飞行学院航空工程学院,广汉618307
  • 收稿日期:2016-09-13 出版日期:2017-02-28 发布日期:2017-02-28
  • 通讯作者: 陈淑仙(1975-),女,博士,教授,主要从事复合材料固化过程研究,bellesavana@163.com。
  • 作者简介:唐庆如(1965-),男,硕士,教授,主要从事复合材料和航空发动机应用的研究。
  • 基金资助:
    国家自然科学基金民航联合基金重点项目(U1233202,U1333201);国家自然科学基金项目(51306201);中国民用航空飞行学院研究生创新项目(X2015-8)

EFFECTS OF REPAIR ANGLES ON THE TEMPERATURE AND THERMAL STRESS OF COMPOSITE PATCHES DURING CURING PROCESS

TANG Qing-ru, TIAN Qiu-shi, PANG Jie, CHEN Shu-xian*   

  1. Aviation Engineering Institute, Civil Aviation Flight University of China, Guanghan 618307, China
  • Received:2016-09-13 Online:2017-02-28 Published:2017-02-28

摘要: 利用有限元方法,数值模拟了不同挖补角度的树脂基复合材料修补片热固化过程中的温度场和热应力场,并分析了挖补角度对修补片的温度、固化度和热应力的影响。仿真计算结果表明:挖补角度越小,修补片中心点处的温度峰值越大,固化速率越快,热应力越大;挖补角度越小,修补片非中心点处的固化速率越快,热应力越小,且挖补角度对非中心点处的热应力影响较大。综合分析后可知,在一定挖补角度范围内,合理选择挖补角度,可控制修补材料内部热应力,并获得较好的复合材料修补质量。研究结果为实际修理提供了良好的数值依据。

关键词: 树脂基复合材料, 修补片, 挖补角度, 固化过程, 温度场, 热应力

Abstract: The physical and mathematical models of composite patches during curing process are established using finite element analysis. The temperature field and the thermal stress field of resin matrix composite patches in different repair angles are simulated during curing process. The effects of repair angles on temperature, curing degree and thermal stress of patches are studied. The results show that, the smaller the repair angles are, the larger of the temperature peak and the thermal stress at the center of patch, and the faster of the curing rate will be. At decentered point of patch, the curing rate is faster, the thermal stress is smaller for small repair angles than that for larger one, and the repair angles have important effect on the value of the thermal stress. Based on the comprehensive analysis, it can be concluded that, within the scope of the repair angles, the repair angles is smaller, the repair quality of composite patches is better. The research results provide the good numerical basis for the actual repair.

Key words: resin matrix composite, patch, repair angles, curing process, temperature field, thermal stress

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