玻璃钢/复合材料 ›› 2019, Vol. 0 ›› Issue (12): 72-76.

• 应用研究 • 上一篇    下一篇

基于MF/Malek法的FM94胶黏剂固化反应动力学建模

裴石凯1, 李毅波1,2*, 杨远程3, 李剑1   

  1. 1.中南大学机电工程学院,长沙410083;
    2.中南大学高性能复杂制造国家重点实验室,长沙410083;
    3.中南大学轻合金研究院,长沙410083
  • 收稿日期:2019-03-06 出版日期:2019-12-28 发布日期:2019-12-28
  • 通讯作者: 李毅波(1981-),男,博士,副教授,主要从事胶接工艺与数值模拟方面的研究,yibo.li@csu.edu.cn。
  • 作者简介:裴石凯(1995-),男,硕士,主要从事热固性树脂基复合材料的固化变形方面的研究。
  • 基金资助:
    国家自然科学基金资助项目(51575535)

MODELING THE CURING KINETICS OF FM94 ADHESIVE BASED ON MF/MALEK METHOD

PEI Shi-kai1, LI Yi-bo1,2*, YANG Yuan-cheng3, LI Jian1   

  1. 1.College of Mechanical and Electrical Engineering, Central South University, Changsha 410083, China;
    2.State Key Laboratory of High Performance and Complex Manufacturing, Central South University,Changsha 410083, China;
    3.Light Alloy Research Institute, Central South University, Changsha 410083, China
  • Received:2019-03-06 Online:2019-12-28 Published:2019-12-28

摘要: 采用非等温差示扫描量热法(DSC)对环氧树脂FM94胶黏剂的固化动力学进行了研究。基于Model-Free法,分析了不同升温速率下的DSC曲线,解释了FM94胶黏剂的固化机理,求解了反应活化能E值,并通过Malek法确定了固化机理函数为自催化模型。结果表明,采用Model-Free法与Malek法结合获得的自催化模型与实验数据吻合得较好,求解得到的模型在升温速率为2 K/min~10 K/min下能较为准确地描述环氧树脂FM94胶黏剂的固化反应过程。

关键词: 非等温DSC, FM94胶黏剂, 固化机理, Model-Free法, Malek法

Abstract: The curing kinetics of epoxy resin FM94 adhesive was studied by differential scanning calorimetry (DSC) at different heating rates. The activation energies of the curing reaction were calculated based on Model-Free method by analyzing DSC curves at different heating rates, and the curing mechanism of FM94 adhesive was explained. The most probable curing mechanism function was determined by Malek method. The results indicated that the two-parameter (m, n) autocatalytic model can well describe the curing reaction process of FM94 adhesive. The fractional conversion of DSC curves obtained using the experimental data showed a good agreement with the curves calculated theoretically under 2 K/min~10 K/min heating rates.

Key words: dynamic DSC, FM94 adhesive, curing mechanism, Model-Free method, Malek method

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