玻璃钢/复合材料 ›› 2019, Vol. 0 ›› Issue (4): 5-11.

• 基础研究 •    下一篇

热边界条件对复合材料层合板固化过程的影响

唐庆如, 包正弢, 陈淑仙*   

  1. 中国民用航空飞行学院航空工程学院, 广汉 618307
  • 收稿日期:2018-07-19 出版日期:2019-04-28 发布日期:2019-04-28
  • 通讯作者: 陈淑仙(1975-),女,博士,教授,主要从事复合材料热固化过程方面的研究,bellesavana@163.com。
  • 作者简介:唐庆如(1965-),男,硕士,教授,主要从事复合材料和航空发动机方面的研究。
  • 基金资助:
    国家自然科学基金民航联合基金(U1233202);四川省科技计划项目(2019YJ0722);中国民用航空飞行学院研究生创新项目(X2017-10);中国民用航空飞行学院科学研究基金(J2019-033)

INFLUENCE OF THERMAL BOUNDARY CONDITIONS ON CURE PROCESS OF COMPOSITES LAMINATE

TANG Qing-ru, BAO Zheng-tao, CHEN Shu-xian*   

  1. Aviation Engineering Institute, Civil Aviation Flight University of China, Guanghan 618307, China
  • Received:2018-07-19 Online:2019-04-28 Published:2019-04-28

摘要: 为了降低热固性树脂基复合材料在热补仪加热固化过程中的峰值温度以及优化其温度场分布,提出了在复合材料层合板上表面分别采用定温、对流换热边界条件和在层合板上表面放置铝制模具三种基于热边界条件的优化方法。通过有限元方法计算了上述三种情况下层合板的温度场和固化度场,并和已有方法做了对比。计算结果表明:相较于已有方法,采用以上优化方法均可以降低层合板的峰值温度并改善其温度场分布;层合板上表面定温时,其峰值温度降低最多;上表面对流换热时,峰值温度降低最少;上表面放置铝制模具时,铝的增强导热性能可以使层合板在平行于模具平面内的温度梯度较为均匀。

关键词: 树脂基复合材料, 固化过程, 固化度, 温度场

Abstract: In order to reduce peak temperature of the thermosetting resin matrix composites and optimize the temperature field distribution during the process of curing based on hot bonder, three optimization methods of thermal conditions are proposed, i.e., isothermal boundary conditions, convective heat transfer boundary conditions and a aluminum mould are set respectively on the top surface of laminated plate. The degree of cure and temperature field distribution above three conditions are calculated by the finite element method, and compared with traditional method. The calculation results show that compared with existing methods, the optimization method can reduce the peak of temperature and optimize the temperature field distribution of laminated plates. The peak temperature drops the most on isothermal boundary conditions, while it drops the least on convective heat transfer boundary conditions. The temperature gradient of laminated plates in parallel to the mold surface is relatively uniform with good thermal conductivity of aluminum when aluminum mold are set on the top surface of laminated plate.

Key words: resin matrix composites, curing process, degree of cure, temperature field

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