复合材料科学与工程 ›› 2020, Vol. 0 ›› Issue (2): 117-121.

• 应用研究 • 上一篇    

改性2-乙基咪唑环氧树脂潜伏型固化剂的制备

沈仲淘, 章桥新*   

  1. 武汉理工大学材料科学与工程学院,武汉430070
  • 收稿日期:2019-04-23 出版日期:2020-02-28 发布日期:2020-02-28
  • 通讯作者: 章桥新(1961-),男,教授,主要从事特种材料与表面工程等方面的研究,Zhangqx@whut.edu.cn。
  • 作者简介:沈仲淘(1993-),男,硕士研究生,主要从事复合材料方面的研究。

PREPARATION OF MODIFIED 2-ETHYLIMIDAZOLE LATENTCURING AGENT FOR EPOXY RESIN

SHEN Zhong-tao, ZHANG Qiao-xin*   

  1. School of Materials Science and Engineering, Wuhan University of Technology, Wuhan 430070, China
  • Received:2019-04-23 Online:2020-02-28 Published:2020-02-28

摘要: 通过2-乙基咪唑(2EI)分别与N-(4-羟基苯基)马来酰亚胺(HPM)和三聚氯氰反应,成功地合成了两种改性2-乙基咪唑衍生物,分别采用红外光谱、核磁共振对其分子结构进行表征。将制备的改性咪唑类固化剂与环氧树脂混合,研究了树脂体系的固化特性和潜伏性。研究表明:相比EP/2EI体系,改性固化体系的固化放热区间均向高温区域移动;此外,改性固化体系在室温下具有更长的储存期。具有强吸电子效应的马来酰亚胺基团和三嗪环降低了咪唑环的亲核性,抑制了固化剂的室温固化活性。此外,在升温条件下,改性固化剂可以克服固化反应能量势垒,恢复快速固化能力。

关键词: 环氧树脂, 2-乙基咪唑, 改性, 潜伏型固化剂

Abstract: In order to prepare imidazole latent curing agents, two modified 2-ethylimidazole derivatives were synthesized by the reaction of 2-ethylimidazole (2EI) with N-(4-hydroxyphenyl) maleimide (HPM) and trichlorocyanide, respectively. Their molecular structures were characterized by IR and NMR. The results showed that N-(4-hydroxyphenyl) maleimide (HPM) and cyanuric chloride reacted with 2-ethylimidazole respectively and completely, and the corresponding target products were obtained. The modified imidazole curing agent was mixed with epoxy resin to study the curing properties and latency of the resin system. The results show that compared with EP/2EI system, the exothermic zone of the modified curing system moves to the high temperature region, and the modified curing system has a longer storage period at room temperature. Maleimide group and triazine ring with strong electron absorption effect reduce the nucleophilicity of imidazole ring and inhibit the curing activity of curing agent at room temperature. In addition, the modified curing agent can overcome the energy barrier of curing reaction and restore the rapid curing ability under the heating condition.

Key words: epoxy resin, 2-ethylimidazole, modification, latent curing agent

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