X850复合材料热压罐成型固化行为研究

复合材料科学与工程 ›› 2021, Vol. 0 ›› Issue (2): 32-37.

X850复合材料热压罐成型固化行为研究

汪敏, 栾英伟, 徐鹏, 高龙飞, 王世杰, 李振友

中国商飞上海飞机制造有限公司,上海200123

收稿日期:2020-07-06 出版日期:2021-02-28 发布日期:2021-03-10
作者简介:汪敏(1990-),男,博士,主要从事复合材料热压罐成型方面的研究,wangmin.luck@foxmail.com。
基金资助:
上海市科学技术委员会“扬帆计划”(19YF1417200);中国商飞科技创新专项[WBS:3-0302300-001]

STUDY ON CURING BEHAVIOR OF X850 COMPOSITE MATERIAL DURING AUTOCLAVE PROCESS

WANG Min, LUAN Ying-wei, XU Peng, GAO Long-fei, WANG Shi-jie, LI Zhen-you

COMAC Shanghai Aircraft Manufacturing Co. , Ltd. , Shanghai 200123, China

Received:2020-07-06 Online:2021-02-28 Published:2021-03-10

摘要/Abstract

摘要： 采用恒温DSC试验手段,分别研究了X850体系材料树脂在100 ℃、110 ℃、120 ℃以及130 ℃下的固化放热效应,基于自催化反应模型对树脂固化行为进行非线性拟合得到了树脂固化动力学方程为dα/dt=7.76×10⁸exp(-10352.8/T)α^0.5928(1-α)^1.4628。借助二次开发技术,将所得到的固化动力学方程嵌入Fluent软件中,模拟了X850预浸料层合板的固化过程,试验与模拟对比结果表明:所建立的固化动力学模型能够准确反映热压罐固化过程中树脂的放热效应,树脂固化放热是造成实际生产过程中出现“温度过冲”现象的主要原因,而且随着层合板铺层厚度的增加,树脂的放热效应加剧,内部产生的热量难以有效地往外传递,在零件实际制备时需要做好散热处理。

关键词: 复合材料, 固化动力学, DSC, 数值模拟

Abstract: The exothermic effects of the resin curing at 100 ℃, 110 ℃, 120 ℃ and 130 ℃ were studied by means of constant temperature DSC experiments. The curing behavior of the resin was nonlinear fitted based on the autocatalytic reaction model. The specific form of curing kinetics equation is as follows: dα/dt=7.76×10⁸exp(-10352.8/T)α^0.5928(1-α)^1.4628. With the help of secondary development technology, the curing kinetics equation was embedded into FLUENT software to simulate X850 laminates curing process. Comparison between experiment and simulation results show that the established curing kinetic model can accurately reflect the exothermic effect of resin during the autoclave curing process. The exothermic effect of resin curing is the main reason for the phenomenon of "temperature overshoot" in the actual production process, and with the increase of the laminate thickness, the exothermic effect of resin is intensified. It is difficult to transfer the heat from inside to outside effectively. In the actual preparation of parts, heat dissipation should be done well.

Key words: composite material, curing kinetics, DSC, numerical simulation

中图分类号:

TB332

汪敏, 栾英伟, 徐鹏, 高龙飞, 王世杰, 李振友. X850复合材料热压罐成型固化行为研究[J]. 复合材料科学与工程, 2021, 0(2): 32-37.

WANG Min, LUAN Ying-wei, XU Peng, GAO Long-fei, WANG Shi-jie, LI Zhen-you. STUDY ON CURING BEHAVIOR OF X850 COMPOSITE MATERIAL DURING AUTOCLAVE PROCESS[J]. COMPOSITES SCIENCE AND ENGINEERING, 2021, 0(2): 32-37.

参考文献

[1] 白光辉, 晏冬秀, 张冬梅, 等. 大型复杂框架式模具温度场模拟[J]. 复合材料学报 , 2013, 30(s1): 169-174.
[2] 唐占文, 张博明. 复合材料设计制造一体化中的固化变形预报技术[J]. 航空制造技术, 2014(15): 32-37.
[3] 张纪奎, 郦正能, 关志东, 等. 热固性复合材料固化过程三维有限元模拟和变形预测[J]. 复合材料学报, 2009, 26(1): 174-178.
[4] 左德峰, 朱金福, 黄再兴. 树脂基复合材料固化过程中温度场的数值模拟[J]. 南京航空航天大学学报, 1999, 31(6): 701-795.
[5] 陈浩然, 杨正林, 唐立民. 复合材料层合板固化过程的数值模拟[J]. 应用力学学报, 1998, 15(3): 30-36.
[6] 孙晶, 李艳霞, 顾轶卓, 等. U形层板热压罐成型温度场三维数值模拟[C]//复合材料:创新与可持续发展(上册). 2010: 532-536.
[7] 黄其忠, 任明法, 陈浩然, 等. 复合材料先进网格结构共固化工艺的温度场模拟[J]. 复合材料学报, 2011, 28(3): 141-147.
[8] 张既奎, 张江,马志阳,等. 厚截面层合板非同步固化的三维有限元分析[J]. 北京航空航天大学学报, 2013, 39(11): 1464-1469.
[9] GUO Z S, DU S, ZHANG B. Temperature distribution of thick thermoset composites[J]. Modelling and Simulation in Materials Science and Engineering, 2004, 12(3): 443-452.
[10] 元振毅, 王永军, 张跃, 等. 基于材料性能时变特性的复合材料固化过程多场耦合数值模拟[J]. 复合材料学报, 2015, 32(1): 167-175.
[11] SKORDOS A A, PARTRIDGE I K . Cure kinetics modeling of epoxy resins using a non-parametric numerical procedure[J]. Polymer Engineering and Science, 2001, 41(5): 793-805.
[12] KARKANAS P I, PARTRIDGE I K. Cure modeling and monitoring of epoxy/amine resin systems. I. Cure kinetics modeling[J]. Journal of Applied Polymer Science, 2015, 77(7): 1419-1431.
[13] YOUSEFI A, LAFLEUR P G Y, GAUVIN R. Kinetic studies of thermoset cure reactions: A review[J]. Polymer Composites, 1997, 18(2): 157-168.
[14] 代晓青, 肖加余, 曾竟成, 等. 等温DSC法研究RFI用环氧树脂固化动力学[J]. 复合材料学报, 2008, 25(4): 18-23.
[15] 郭战胜, 杜善义, 张博明, 等. 厚截面树脂基复合材料的温度场研究Ⅰ: 模拟[J]. 复合材料学报, 2004, 21(5): 122-127.