玻璃钢/复合材料 ›› 2019, Vol. 0 ›› Issue (6): 24-29.

• 基础研究 • 上一篇    下一篇

酚酞基聚芳醚酮/环氧树脂共混体系流变性能及固化反应动力学的研究

周帅1,2,3, 程超1,2,3, 孙泽玉1,2,3, 张辉1,2,3*   

  1. 1.纤维材料改性国家重点实验室,东华大学材料科学与工程学院,上海201620;
    2.上海市轻质楼结构复合材料重点实验室,上海201620;
    3.民用航空复合材料协同创新中心,上海201620
  • 收稿日期:2018-09-30 出版日期:2019-06-25 发布日期:2019-06-28
  • 通讯作者: 张辉(1984-),博士,讲师,主要从事纤维及其复合材料等方面的研究,zhanghui@dhu.edu.cn;
    余木火(1961-),男,博士,教授,主要从事纤维增强树脂基复合材料等方面的研究,yumuhuo@dhu.edu.cn。
  • 作者简介:周帅(1992-),男,硕士,主要从事复合材料增韧技术方面的研究。
  • 基金资助:
    中央高校基本科研业务费专项资助(18D110622);上海市科学技术委员会资助(18DZ1101003)

STUDY ON RHEOLOGICAL PROPERTIES AND CURING REACTION KINETICS OF PEK-C/EPOXY RESIN BLEND SYSTEM

ZHOU Shuai1,2,3, CHENG Chao1,2,3, SUN Ze-yu1,2,3, ZHANG Hui1,2,3*   

  1. 1.State Key Laboratory for Modification of Chemical Fibers and Polymer Materials,College of Materials Science and Engineering, Donghua University,Shanghai 201620, China;
    2.Key Laboratory of Shanghai City for Lightweight Composites, Shanghai 201620, China;
    3.Center for Civil Aviation Composites, Shanghai 201620, China
  • Received:2018-09-30 Online:2019-06-25 Published:2019-06-28

摘要: 利用酚酞基聚芳醚酮(PEK-C)对环氧树脂进行了增韧改性,系统研究了不同PEK-C含量的PEK-C/E51/E100共混体系的流变性能,采用DSC分析了在不同升温速率下不同PEK-C含量对共混体系固化反应的影响,并详细计算了各共混体系固化反应的表观活化能和固化反应级数。结果表明,PEK-C的引入缩短了共混体系的凝胶时间,这可能与PEK-C中的羟基对环氧树脂的固化具有促进作用有关;同时,PEK-C的加入并不影响环氧树脂的固化机理。

关键词: 酚酞基聚芳醚酮, 环氧树脂, 流变性能, 固化反应动力学

Abstract: The epoxy resin was toughened and modified by polyetherketone cardo (PEK-C) in the paper. The rheological properties of PEK-C/E51/E100 blends with different PEK-C contents were systematically studied. The effects of different PEK-C contents on the curing reaction of blends at different heating rates were analyzed by DSC, and the apparent activation energy and curing reaction order of the curing reaction of each blend system were calculated in detail. The results show that the introduction of PEK-C shortens the gelation time of the blend system, which may be related to the promotion of the curing of epoxy resin by the hydroxyl groups in PEK-C. Meanwhile, the addition of PEK-C does not affect the curing mechanism of the epoxy resin.

Key words: PEK-C, epoxy resin, rheological properties, curing reaction kinetics

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