复合材料科学与工程 ›› 2024, Vol. 0 ›› Issue (8): 11-16.DOI: 10.19936/j.cnki.2096-8000.20240828.002

• 基础研究 • 上一篇    下一篇

适用于RTM工艺的环氧改性苯并噁嗪树脂的性能研究

李嘉敏1, 谭丽娜2, 蒋函蔚1, 范如意2, 冉起超1*   

  1. 1.四川大学 高分子科学与工程学院 高分子材料工程国家重点实验室,成都 610065;
    2.上海飞机制造有限公司,上海 200120
  • 收稿日期:2023-07-05 出版日期:2024-08-28 发布日期:2024-09-25
  • 通讯作者: 冉起超(1981—),男,博士,教授,研究方向为耐热高分子及复合材料,ranqichao@scu.edu.cn。
  • 作者简介:李嘉敏(1998—),女,硕士研究生,研究方向为苯并噁嗪树脂及复合材料。
  • 基金资助:
    大飞机先进材料联盟项目“苯并噁嗪液体成型树脂”

Study on properties of epoxy modified benzoxazine resin for RTM technology

LI Jiamin1, TAN Lina2, JIANG Hanwei1, FAN Ruyi2, RAN Qichao1*   

  1. 1. State Key Laboratory of Polymer Materials Engineering, College of Polymer Science and Engineering, Sichuan University, Chengdu 610065, China;
    2. Shanghai Aircraft Manufacturing Co., Ltd., Shanghai 200120, China
  • Received:2023-07-05 Online:2024-08-28 Published:2024-09-25

摘要: 复合材料行业的发展需要开发具有良好工艺特性和高耐湿热性的RTM专用树脂基体。本文使用E6110、AFG90、AG80三种高耐热环氧树脂,分别对二胺型苯并噁嗪(DC-BOZ)进行共混改性,对比研究了共混树脂体系的黏度特性、凝胶化反应、固化行为、聚合反应及固化物的耐热性、耐湿热性和热稳定性。结果表明,环氧树脂的加入降低了苯并噁嗪的黏度,延长了适用期,其中,DC/E6110在100 ℃下10 h后的黏度仅为333 mPa·s,满足RTM工艺要求。环氧树脂的加入会影响体系的凝胶化时间,使固化峰值温度略有增加。环氧树脂可以与苯并噁嗪发生共聚交联反应,从而增加共聚体系的交联密度,致使改性树脂体系的耐热性、耐湿热性和热稳定性均明显增加。其中,DC/E6110的玻璃化转变温度(Tg)提升至209 ℃,相较改性前增加了44 ℃。此外,各体系的湿态Tg相比干态Tg均出现不同程度的降低,但DC/E6110的湿态Tg仍能达到189 ℃。本文开发的低黏度、耐湿热树脂基体可用于RTM工艺制备大型复合材料制件。

关键词: 苯并噁嗪, 环氧树脂, RTM, 低黏度, 湿态Tg, 复合材料

Abstract: The development of composite industry requires special resin matrixes with good processing characteristic and high wet-heat resistance for RTM technology. In this paper, three kinds of epoxy resins with high heat resistance, E6110, AFG90 and AG80, were used to modify a diamine-type benzoxazine resin (DC-BOZ). The viscosity characteristics, gelation reaction, curing behavior, polymerization reaction, heat resistance, wet-heat resistance and thermal stability of the mixtures were compared. The results showed that the addition of epoxy resins reduced the viscosity of benzoxazine and extended the pot life. Among them, the viscosity of DC/E6110 was only 333 mPa·s after 10 h at 100 ℃, which meets the requirement of RTM process. The addition of epoxy resins affected the gelation time of the system and increased the curing peak temperature slightly. Epoxy resins can copolymerize with benzoxazine and increase the crosslinking densities of copolymerization systems, resulting in the significantly improvement of heat resistance, wet-heat resistance and thermal stability of the modified resin systems. Particularly, the glass transition temperature (Tg) of cured DC/E6110 was increased to 209 ℃ with an increase of 44 ℃ compared with the polybenzoxazine. In addition, the wet Tgs of all systems decreased, but the wet Tg of DC/E6110 still reached 189 ℃. A new resin matrix with low viscosity and good wet-heat resistance developed in this paper can be used to prepare large composite parts by RTM process.

Key words: benzoxazine, epoxy resin, RTM, low viscosity, wet Tg, composites

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