关键词: 含硅芳炔, RTM成型, 化学流变, 固化动力学

Abstract:

Siliconarylacetylenecontaining resin (PSAR) is applied in aerospace and electrical

industries， which is suitable for resin transfer molding with hightemperature resistant，

excellent dielectric constant， hightemperature mechanical property and processability. The cure

kinetics of PSAR resin was analyzed by using dynamic differential scanning calorimetry(DSC)， and

it was found that the cure of PSAR resin followed an nthorder reaction mechanism. The reaction

order was nearly two with activation energy of 110kJ·mol1. The chemorheological behavior of PSA

R resin was studied with parallel plate viscosity spectrometer. A rheological mode based on the dual

Arrhenius equation was estabilished and used to simulate the rheological behavior of PSAR resin.

The model prediction determined from the dualArrhenius equation was in good agreement with

experimental data.

Key words: siliconarylacetylenecontaining resin, resin transfer molding, chemorheology, cure kinetics