耐高温聚酰亚胺树脂复合材料固化封装技术研究

梁恒亮, 周洪飞, 陈静

Research on the curing packaging technology of high temperature polyimide composites

LIANG Heng-liang, ZHOU Hong-fei, CHEN Jing

复合材料科学与工程 . 2022, (1): 112 -116 . DOI: 10.19936/j.cnki.2096-8000.20220128.017